Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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And this when they'll be talking about it. 50mins is a long time.  So it'll no doubt be good detail 


Session T12 - Tapa 2 Monolithic and Heterogenous Integration Thursday, June 16


Co-Chairs: S. Chowdhury, Stanford Univ.

M. Takenaka, The University of Tokyo

T12-1 - 1:50 p.m.

A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical InterposerTM, S. Venkatesan, J. Lee, S. Goh, B. Pile, D. Meerovich, J. Mo, Y. Jing, L. Soldano, B. Xu*, Z. Yu*, A-Y Thean*, Y. K. Lim*, Poet Technologies, *NUS

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