Re: White paper?

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Re: White paper?

posted on May 04, 2022 06:18PM

A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical InterposerTM 1 Suresh Venkatesan, 1 James Lee, 1 Simon Chun Kiat Goh, 1 Brian Pile, 1 Daniel Meerovich, 1 Jinyu Mo, 1 Yang Jing, 1 Lucas Soldano, 2,3Baochang Xu, 2 Yu Zhang, 2,3Aaron Voon Yew Thean, 2,3Yeow Kheng Lim 1 POET Technologies, 2 Department of Electrical and Computing Engineering National University of Singapore, 3 Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre, National University of Singapore

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