Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: White paper?

Foxy, the link you have provided is for the paper being presented at the upcoming IEEE VLSI Symposium.

A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical InterposerTM, S. Venkatesan, J. Lee, S. Goh, B. Pile, D. Meerovich, J. Mo, Y. Jing, L. Soldano, B. Xu*, Z. Yu*, A-Y Thean*, Y. K. Lim*, Poet Technologies, *NUS

 

https://www.vlsisymposium.org/program/schedule-at-a-glance/

 

 

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