Foxy, the link you have provided is for the paper being presented at the upcoming IEEE VLSI Symposium.
A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical InterposerTM, S. Venkatesan, J. Lee, S. Goh, B. Pile, D. Meerovich, J. Mo, Y. Jing, L. Soldano, B. Xu*, Z. Yu*, A-Y Thean*, Y. K. Lim*, Poet Technologies, *NUS
https://www.vlsisymposium.org/program/schedule-at-a-glance/