Finally, here is a post to a comprehensive technical paper from the team at Rockley Photonics detailing the challenges and opportunities in co-packaged optics for datacenters. The paper describes the evolution of datacenter switch ASICs, datacenter optics, roadmap challenges and co-packaged optics for addressing these challenges.

 Interesting to note that multiple CAI employees, inckuding Preet Virk and Ankur, "liked" the post regarding Rockley's technical paper (and are much more qualified than some on this board)

 https://www.linkedin.com/posts/ramtrichur_siliconphotonics-cpo-advancedpackaging-activity-6891088237763416064-FGRi

We trust these experts with the technical details, and of course Vivek, who is also on the CAI Technical Advisory Board along with Near Margalit who replaced Alexis at Broadcom (who is also on the BOD in her Meta role): https://www.celestial.ai/team

Leb:

This looks like a really good reference paper on  co-packaged optics with references to the existing IEEE standards and MSA as they existed as of Sept 2020. I have yet to see any reference to Rockley's platform...Is there any?  

Anyway I will spend some time going over this paper and thanks for posting. Did you gain any insights from this paper that you would like to share?

I expect it is probably worth linking to our Agora Library…thanks again for sharing.