Agoracom: Small Cap Investment - POET Technologies Inc. - Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

Stubbel01

Nov 30, 2019 06:59PM

Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

killer66

Nov 30, 2019 09:52PM

Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

Babaoriley

Nov 30, 2019 10:07PM

Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

fairchijisback

Dec 01, 2019 05:23AM

Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

fairchijisback

Dec 01, 2019 05:30AM

fairchijisback

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Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

in response to

Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

fairchijisback

posted on Dec 01, 2019 06:02AM

Referring to FIG. 11, a schematic diagram is shown for a solder ball deposition system such as the SB 2-Jet system manufactured by Packaging Technologies GmbH

https://www.youtube.com/watch?time_continue=2&v=Qv-qN_4Vn4M&feature=emb_logo

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Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

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Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

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Dec 01, 2019 09:09AM

Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES