Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: DIE TESTING... WAS: Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

It all sounds good to me........That reminds me of a company that wanted to buy 30-meter spools of wire from an American company that sold spools of wire in 100ft lengths. It was a big order so they thought they'd make the sale and change the spools to 30 meters, cutting each length to match the order. 30 meters equaled about 98.5 ft.....Some smartass came along and said what are you going through all that trouble for cutting off a piece of wire that is 18 inches long and good for Sweet FA. Just give them the 100 ft spool, save yourself a lot of work and make the customer a lot happier at the same time. Guess you've heard that one before but that's what that reminds me of. ha GLTA, Time to get this thing moving higher.

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