Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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fairchijisback

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Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

in response to

Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES

fairchijisback

posted on Dec 01, 2019 06:02AM

Referring to FIG. 11, a schematic diagram is shown for a solder ball deposition system such as the SB 2-Jet system manufactured by Packaging Technologies GmbH