Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: A new era of advanced manufacturing

The high end packaging side that is driven by efforts to  make the high end smart phones thinner, faster, more energy efficient portable devices and  those very advanced chip packaging processes applied to the optical interposer based engine.

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If I remember correctly, POET has been issued patents covering their packaging innovations, separately from the tech that is being packaged.

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Sep 27, 2019 07:06PM
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