Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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BABA>The presentation may have been the reason for the late rally - hope it wasn't, or, if it was, then something material comes of it!

Good to  see the  share price moving higher but in my opinion it has long way to  go  before it  begins to reflect what is emerging as a new platform that could completely change the cost structure of data transfer (and more).  Something that touches so much of what a modern society relies upon.

Just to recap here is the intro to Suresh’s presentation…it speaks for itself:  

MR SURESH VENKATESAN, CEO – POET TECHNOLOGIES | TOPIC: CHIP SCALE ASSEMBLY FOR PHOTONIC OPTICAL ENGINES USING THE POET OPTICALINTERPOSERTM

The era of “More than Moore” has extended to the Photonics world with POET’s Optical Interposer Platform, which facilitates the co-packaging of electronics and optics in a single Multi-Chip Module (MCM). Simply put, Optical Interposers pave the way for “Photonics-in-a-package”. Based on its Dielectric Waveguide technology, POET’s Optical Interposer provides the ability to run electrical and optical interconnections in a common interconnect fabric on the same interposer chip at a micrometer scale. Hybrid Integrated Photonics Packaging (HiPP) enabled by the Optical Interposer plays a critical role in improving electrical and thermal performance, power consumption and form factor of the photonics sub-assemblies. The optical interposer currently forms an integral part of POET’s hybrid integrated optical engines and leverages the manufacturing processes and unique capabilities of its dielectric waveguides.

 

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