thank-you sman; it does appear the CC win has affected our ability to go into an more indept embedded aspect noting the eMMC.

Kingston 'with-pred' and Toshiba both 'with-pred' leaves the other biggies Samsung/Micron/Hynix etc...

I'm no engineer, but looking at the Samsung K9PFG08 flash memory chip, fig 17

https://www.ifixit.com/Teardown/iPhone+4+Teardown/3130

which from my query is NAND and built same as MLC types; makes me wonder if this will be our next target because it was prominant in iphone 4 - then they went to TLC which is 'triple-layer-controler nand...

http://www.iphonehacks.com/2014/11/apple-rumored-relying-on-samsung-for-watch-components.html

IDK -

All I do know is this should get very interesting now.

This Spansion/ACER eMMC new 'e' aspect imo is a shot across the bow to Apple/Samsung others.

I made quite-a-bit money playing spansion before it relisted; looks like gona make some more.

e