Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Ongoing Research at SCL India
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I possess zero competencies in this area and rely heavily upon my colleagues on this site who have generously shared their skill sets. Once again I thank...

But this phrase seems very familiar to me: " ... proposed to develop a new technology which can combine silicon and GaAs substrates by wafer bonding or Epitaxy on Electronics (EoE)". tpower

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