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Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Date of patent : June 11th, 2024

Patent number : US-12007604-B2

Inventors : William Ring, High Bridge, NJ (US); Miroslaw Florjanczyk, Kanata (CA); Suresh Venkatesan, Los Gatos, CA (US)

Title : Optical dielectric planar waveguide process

https://ppubs.uspto.gov/dirsearch-public/print/downloadPdf/12007604

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