Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: EOMM by SHINE
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Does this introduce competency in a new group of materials? Does it pave the way to some excellent improvements in data throughput well beyond the 400 and 800G parts? 

I'm actually asking--"explain this like I am eleven" :)

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