Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Rainer
Sep 06, 2018 01:01PM
Icon president Re: CIOE presentation
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Rainer
Sep 06, 2018 01:27PM
Re: CIOE presentation
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Shash
Sep 06, 2018 01:35PM

oops   wrong order

it's the process of separating the die from the wafer after assembly

Ususally, but not always done with tiny diamond saws cutting through the void arrears on the wafer

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