Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

Free
Message: Re: CIOE presentation
26
Sep 06, 2018 01:01PM
22
Sep 06, 2018 01:27PM

it's the process of separating the wafer from the die it has been cast on.

6
Sep 06, 2018 01:44PM
Share
New Message
Please login to post a reply