Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Senior R&D Engineer (Photonics Packaging)
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I would agree, VanVillain. There must be some pre-conditions to be met or a certain state of readiness required, and then some deals can be penciled in. That is my speculative assumption. If not, then it would be riduculous hiring all these people. Companies do not hire for nothing. There is always some sound reasoning or requirement that justifies any hiring.

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