WiLAN Settles Semiconductor Packaging Related Litigation

OTTAWA, Canada – May 1, 2015 – WiLAN (TSX:WIN) (NASDAQ:WILN) today announced that the company's wholly-owned subsidiary, Collabo Innovations Inc., has entered into a settlement and license agreement that resolves pending litigation in the United States District Court for the District of Delaware related to semiconductor packaging technology.

The consideration to be paid to WiLAN as well as all other terms of the agreement are confidential.