It wouldn't suprise me if the Polis guys aren't behind it in someway because if memory serves me right they were Darvic Corporation, which delt with a plasma cleaning process similar to the plasma-etching/ion-milling of semiconductor fabrication.

http://www.engr.sjsu.edu/sbates/images/materials%26plastics/Silicon_Wafer_Processing.pdf

Also here's some DD on simiconductor defects -

''The use of wafer inspection systems in managing semiconductor manufacturing yields is described. These systems now detect defects

of size as small as 40 nm. Some high-speed systems have achieved 200-mm diameter wafer throughputs of 150 wafers per hour. The

particular technologies involved are presented. Extensions of these technologies to meet the requirements of manufacturing integrated

circuits with smaller structures on larger wafers are discussed.''

http://citeseerx.ist.psu.edu/viewdoc/download?doi=10.1.1.117.8318&rep=rep1&type=pdf

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