I just hope it rings true because it sure smacks at making the glue water-tight.

It would complete the software side of it and not limit us to encasement/circuitry plus microOS to achieve security.

Anybody remember them saying back when TI/Actel was involved how the scheem was tamper-proof, 'if you take it apart to examine it you'd destroy it.'

who knows

glad to see it pop back up - at lucky 7 spot also.

emit...