This is a process comparing a density 3.1 million to 47 million with yet a secondary chip involve.....they claim considerable power savings over the 3.1 process for the Atom alone in lighting up 47 million... maybe ...maybe not.

When the devices hit the market....it will be the periphery(SCH) of the processor that eats power....depending on the user application.

"Atom's SCH companion chip integrates northbridge and southbridge along with OpenGL 3D graphics, support for DirectX 9L, and hardware-accelerated 720p and 1080i video decode. The IDE controller has a parallel rather than a relatively more power-hungry serial ATA interface. I/O options included PCI Express, SDIO, and USB Host and Client, says Intel. Supporting both Linux and Windows, the chipsets come with 400MHz or 533MHz FSB buses and support up to 1GB of RAM. The "Atom Centrino" silicon family also includes optional WiFi, WiMax, and other peripheral components, including a penny-sized, 16GB solid state disk option."

The IDE will be parallel......the penny sized SSD, IMO, will be serial.

which leads to my question......who's translation to that 16GB environment will be in there? It's going to be on board the drive itself, or, at the back side of the IFE controller on the SCH.

"Currently, about 20 companies are designing boards and systems based on the parts."

I also noted Israel is not involved, we all know who hangs out there and where their tech crowned. This is not a discriminatory remark.

edigs tech, with regard to periphery, in driving their video/audio offerings, is very small, that is why it saves power. They do not have to utilize the RAM noted above, or, the paging or shadowing to it. Edigs tech could be utilized as an expansion to the platform saving power consumption for video/audio.

This is an attempt at down sizing the PC....and the current SCH is the only one aviable for Atom at this point.

doni