METHOD OF FABRICATING MICRO STRUCTURED SURFACES WITH ELECTRICALLY CONDUCTIVE PATTERNS - A method comprises forming a first pattern on a first flat surface and forming an inverse of the pattern on a second flat surface. The method further comprises attaching the second flat surface to a roller to produce an embossing tool and applying pressure between the embossing tool and a substrate thereby forming a second pattern in the substrate. The substrate is coated with a radiation curable resin material. The method also comprises transferring ink to the substrate, the ink containing a catalyst, and coating the substrate with the second pattern in an electroless plating bath. The first pattern alternatively may be formed on a sleeve which is then attached to a drum/roller.