Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: DesignCon "Optics Innovation Challenges & Opportunities: Unleashing Datacom Efficiency & Bandwidth,"

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Join Matt Sysak, VP of laser & platform engineering, Ayar Labs, and other panelists from Broadcom, Cisco, Intel Corporation, Lightmatter, and NVIDIA as they will participate in a panel at DesignCon moderated by Ansys on Thursday, February 1, 4:00 – 5:15 p.m. PST.

The session, "Optics Innovation Challenges & Opportunities: Unleashing Datacom Efficiency & Bandwidth," will discuss where, when, and how optical technologies can be used in meeting the growing demands of datacenters.

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DesignCon 2024 - Ayar Labs
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