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March 23 (Reuters) - Intel:
* INTEL - PLANS TO USE ASML EXTREME ULTRA VIOLET LITHOGRAPHY MACHINES IN NEW MANUFACTURING PROCESSES - CEO IN WEBCAST
* INTEL CEO - SEE TAPE IN OF 7-NANOMETER 'METEOR LAKE' CPU IN Q2 OF 2021
* INTEL CEO SAYS CO WILL INCREASE ENGAGEMENT WITH TAIWAN SEMICONDUCTOR MANFUCTIRING, SAMSUNG ELECTRONICS CO, GLOBALFOUNDRIES & UNITED MICROELECTRONICS
* INTEL SEES $100 BILLION ADDRESSABLE MARKET IN FOUNDRY BUSINESS - CEO ON WEBCAST
* INTEL CORP SAYS AMAZON, CISCO, QUALCOMM AND MICROSOFT SUPPORT ITS EFFORTS TO OFFER CHIP MANUFACTURING SERVICES - INTEL CEO ON WEBCAST
* INTEL CEO - INVESTMENTS WILL TOTAL $27 BILLION IN U.S. RESEARCH AND DEVELOPMENT AND $33.5 BILLION IN U.S. CAPEX FROM 2019 THROUGH 2021
* INTEL CEO - IN Q3, EXPECT MAJORITY OF OUR CLIENT CPU WAFERS WILL BE ON 10NM
* INTEL CEO - 'WILL ALSO PURSUE CUSTOMERS LIKE APPLE' IN NEW CHIP MANUFACTURING BUSINESS Further company coverage:
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