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Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: The Future of Data Centers : “The 3.2T Co-Packaged Optical Module Project", March 11, 2021.

https://www.lightwaveonline.com/optical-tech/components/article/14199184/oif-launches-32t-copackaged-module-project

Research into a 3.2T co-packaged optical module, targeting technology for data center switching applications has come to an agreement.

“The industry has clearly articulated the need for a standardized co-packaged solution to address data center power constraints, and further, to enable new network architectures and applications”.

 

Lightwave online coverage.

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