Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: TSMC, wow

 

To rebalance its capacity deployment, the company plans to build a new fab in Hsinchu, in the north, for the production of 2-nanometer chips. The chairman reportedly also said that the company might allocate certain facilities to its Taichung manufacturing facility in central Taiwan, in order to support the capacity expansion plan, the report continues.

Well, if they nail it, they'll certainly get all of that business.  Who else would spend the money?

https://evertiq.com/design/48854

 

Looking to the future:

"Heterogeneous integration enables system level integration in a SiP where all the active functions are as densely packed as possible. Interconnect will be  photonic moving the photons as close to the transistors as possible.”

https://agoracom.com/ir/POETTechnologies/forums/discussion/topics/746518-time-for-the-sanan-details/messages/2282365#message

 

 

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