Re: A*Star patent: "PHOTONIC INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME"

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Moska

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Re: A*Star patent: "PHOTONIC INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME"

in response to

A*Star patent: "PHOTONIC INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME"

Stubbel

posted on Apr 14, 2019 02:53PM

Can this patent be the result of this collaboration?:

https://rainerklute.wordpress.com/2018/08/31/poet-technologies-agm-2018/

01:22:48 – Leanne Sievers: Okay. And I’ll continue with you, Suresh. Do we still have ongoing projects with A*STAR, and if yes, at what stage is it, and what is the scope of those projects?

01:22:59 – Suresh Venkatesan: We had started a project with A*STAR, or IMRE specifically, and it was initially targeted at some advancements that we wanted to make on the GaAs technology. This was put in place back in 2016, I believe.

01:23:20 – We continue engaging with them, but we have changed their focus as well, in terms of what they do. They are working with us on DFB lasers, for example, at this point in time. So again, even with A*STAR, we have changed their focus, to be focused more on where we want to go, which is the indium phosphide and the interposer platform. So, yes, we do continue to work with them, but what they working on is different.

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