Well, things continue to plod along at ISRO, recent tender posting for a wafer dicing saw.  So they still appear to be ramping up for something.  Maybe GaAs related, or maybe not.  One day we may know....

https://scl.eprocure.isro.gov.in/viewpages/tendernoticedisplay.asp?6F583E5643D62CFC5AA6612943

the dicing saw is required for (among other things):

i) Epitaxial Wafers having Silicon handling layer and active layer of:

i. Gallium Nitride

ii. Gallium Arsenide

iii. Silicon Germanium

full technical document :

https://scl.eprocure.isro.gov.in/tnduploads/scl/tndheader/IDT00199000000000000isro05401.pdf