Re: 3D Sensing: Present and Future.
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Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications
Message: Re: 3D Sensing: Present and Future.
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See Below....*Shipment of Smartphones with 3D Sensing will increase from 30M in 2017 to 290M in 2019.
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