Baba: Is our stuff gonna be in those interconnection solutions?
Date: Wednesday, October 16th
Time: 10:00am – 10:15am
Location: SJCC Concourse Level – 220C
Andrew will dive into the latest innovations in high-speed data channels and discuss how co-packaged copper and standard OSFP connectors are paving the way for future scalability to 448G. If you're passionate about next-gen data infrastructure and technology advancements, this is an event you won’t want to miss!