Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: How to scale the optical interconnect using Co-Packaged Optics (CPO)

Timotao: So it is better than what Broadcomm is offering?

There is no comparison. Broadcom has chosen CPO modules over pluggables for its switches. This is the data transport aspect and not suitable for the computational aspect => close proximity to GPUs and any other "high thermal design power (TDP) application-specific integrated circuits that are temperature-sensitive for CPO,

There is opportunity for Broadcom to engage POET to provide OEs for Broadcom's CPO modules.   

 

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