Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: CIOE2024

From this link...

https://exhibitors.cioe.cn/jtycn/zsen64914.html

Bold is mine...

Main product:

Hybrid integrated optical engine for 100G, 200G, 400G, 800G, 1.6T, 3.2T data transmission, high-speed module suitable for AI super-computing, and LightBar light source chip used in CPO and smart wear applications.

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and recently chipset for 1.6T and 3.2T data transmission, CPO modules, artificial intelligence, sensing.



 

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