https://www.linkedin.com/jobs/view/assembly-engineer-at-poet-technologies-pte-ltd-3864379996/?originalSubdomain=sg
Assembly Engineer / Principal Engineer
POET TECHNOLOGIES PTE. LTD. · Singapore, Singapore · 19 hours ago · 1 applicant
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Job Description
- Perform machine setup, calibration, testing and mechanical assembly of active devices to the interposer
- Test assembled devices and generated test report and summary
- Troubleshoot assembly issues and document findings for failures analysis
- Liaise with internal teams to manage incoming materials for assembly
- Perform analysis on packaging process specs performance, yield, manufacturing cost and cycle-time; and contribute to planning and execution of essential improvement program
- Able to manage Wafer Preparation including process characterization and improvement
- Hands on Disco Back Grinding and Stealth Dicer equipment with basic maintenance
- Perform die-assembly tool, flip chip bonder, wire bonder, solder ball jetting and CAD drawing
- Knowledge of Analytical Software such as JMP SAS. TIBCO
- Basic knowledge on Advance Package interconnection, Flip Chip, Wafer Bumping, Eutectic Bonding and Solder Ball jetting
Requirements;
- Hand-on experience with die-assembly tools, flip-chip bonder, wire bonder, and CAD drawing is strongly recommended.
- Understanding the packaging of semiconductor wafers is a plus.
- Good written and verbal communication skills
- Graduates from Engineering faculty may be considered
Desired Skills and Experience
JMP, Mechanical Assembly, Troubleshooting, TIBCO, GMP, Unloading, Drawing, Characterization, Packaging, Grinding, Assembling, Assembly, Manufacturing, CAD, Calibration
