Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications
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It should be noted that 200G per lane becomes a 1.6T module with 8 lanes. Double it for 3.2T. Nice move to get ahead of the curve. Good stuff is happening guys. They have learned a lot which has prepared them for this.