Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: Filing for recent placement 424B5 1 form424b5.htm

Also in the grand scheme given amount of warrants involved, minimal dilution, other than short term gyrations I don't expect these warrants should have much of an impact. 
Will just need to wait and see what alternative plans they have to fund development of full module as outlined in recent deck produced on November 6th. 

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