Interesting find Sollozzo, in researching other articles on this news ...comment below is interesting given the Meta dot connections.

https://money.udn.com/money/story/5612/7430254

Industry analysis shows that high-speed data transmission still uses pluggable optical components. As transmission speeds rapidly advance and enter the 800G generation, and enter higher transmission rates such as 1.6T to 3.2T in the future, power loss and heat dissipation management problems will be the biggest. The solution introduced by the semiconductor industry is to integrate silicon photonic optical components and switch application-specific chips (ASICs) into a single module through CPO packaging technology. This solution has begun to be certified and adopted by major manufacturers such as Microsoft and Meta. In the new generation network architecture.