"To that end, Applied Materials just announced a number of new processes and equipment that can handle more advanced chips. Specifically, these machines are geared toward what's called "heterogeneous chip integration" (or just "HI"). As the name implies, HI helps manufacturers (and their ultimate customers that need them to build computers and other intelligent devices) combine diverse chips into new packages. 

Sometimes called "chiplets," think of these as Lego pieces that build a more complex chip system, using 2.5D (two or more chips side-by-side on the same substrate) and 3D (two or more chips stacked on top of each other) architecture. This is a departure from traditional monolithic chip architecture, where a single piece of silicon acts as the complete computing circuit."

Say no more.