Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

Free
Message: Follow tweet

FJ:  "Umm...the actual process to flip chip devices is done in an automated line at wafer scale in a two step bonding process."

FJ, is that a process that POET actually performs, or is it something that a myriad of other companies might be doing now? It is frustrating that someone or someones with access to POET management's ear can't explain to them the lack of transparency and proliferation of amatureish Public Relations efforts is a negative statement. Keeping things under wraps implies that there is.... something to hide.

Share
New Message
Please login to post a reply