Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: New engineer hire at CELESTIAL

https://www.linkedin.com/in/shuhe-li/details/experience/

Shuhe Li

  3rd degree connection
Principal photonics packaging engineer at Rockley Photonics Inc
 

AboutAbout

Technology leader, innovator and problem solver in optical packaging/interconnection and related disciplines. 20 years’ experience in product development and R&D management.
16 published patents/applications, 8 awarded
Skills and experience:
multi-million dollar SBIR contracts management, product design, development, prototype, test and pilot production. Patent development
Leader in novel fiber optics interconnection, Active and passive optical alignment, Right angle optical coupling to silicon photonics and VCSEL/PD, Photonics packaging, DFB laser, VCSEL, detector, LN modulator, Integrated InP chip, MEMS, SOA, Thin film filter, SLED, Fiber optics gyroscope transceiver module, Hybrid integrated DFB and modulator module, All optical transponder, RF over fiber, Design for X, Optical assembly processes development, Laser welding, Optical connector polishing, Optical connector design, Hermetic seal, Dimensional metrology, Machine tool and CMM error compensation, Precision machine design, materials, etc. 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
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