Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Patent Granted

Patent date : february 7th, 2023

Patent number : 11573372

Inventors : William Ring, NJ (USA) and Suresh Venkatesan, Los Gatos CA (USA)

Methods for optical dielectric waveguide structures

https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/11573372

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