TSV:

In electronic engineering, a through-silicon via or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.

POET Technologies job search (Singapore):

Candidate will be part of HiPP integration teaftsvm to work with the internal package layout and external process provider to incorporate silicon/TSV, package stack-up, routing and PDN for POET’s optical interposer platform.

https://sg.linkedin.com/jobs/view/principal-engineer-photonics-ic-packaging-r-d-at-poet-technologies-pte-ltd-3380416630