10:18, SV: By making our interposers completely CMOS compatible we’re able to leverage the broad semiconductor ecosystem to continuously add new capabilities to our interposer that allow us to scale from 2-D packages to 3-D architectures, and that provides competitive solutions, architectures, and form-factors for alternate vertical markets as well. The hybrid assembly of components on the optical interposer converts the interposer into an engine. The engine is the key building block for modules that then support various applications. Over the course of the past year we’ve added prototyping capability for engine assembly, both in our offices in Allentown [USA] as well as in Singapore. This is, of course, in addition to the larger scale assembly capability at our joint venture at Shenzhen. This is what allows us to, on the one hand, commercialize our existing solutions with our joint venture partner [SANAN IC], but on the other hand develop new capabilities, new technologies, new products for the growing marketplace of photonics applications.

11:35, SV: Touching on our key accomplishments in this past year, they fall along four broad categories. First, and most important to our path to commercialization… [audio dropped, again, then jumps ahead]… completed alphas and betas and customer samples of various products, as Vivek talked about--100G/200G FR4, 100G LR4, 400G FR4 receivers—to various customers. We received feedback from them. In many cases we had to make some changes to enable these engines to be utilized in modules. But those changes have all been incorporated into production designs and these production designs are currently running at our foundry SilTerra.

Thanks to ITTR for this too.