Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Techie folks - What do you think of this Paper from Marvell about 2.5D integration

https://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=9923558

 

Quote: Heterogeneous integration is an enabler for realizing higher speed optical components. Eliminating wire bonds and other sources of signal discontinuities are the key for high speed and improved thermal performance. There are several approaches to heterogeneous integration, and we have explored one in this paper. The method discussed here uses the silicon photonics chip as the interposer for the 2D integration. This interposer, with TSV’s and backside solder bumps, is assembled on to a high-speed substrate for the final 2.5D assembly

 

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