https://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=9923558
Quote: Heterogeneous integration is an enabler for realizing higher speed optical components. Eliminating wire bonds and other sources of signal discontinuities are the key for high speed and improved thermal performance. There are several approaches to heterogeneous integration, and we have explored one in this paper. The method discussed here uses the silicon photonics chip as the interposer for the 2D integration. This interposer, with TSV’s and backside solder bumps, is assembled on to a high-speed substrate for the final 2.5D assembly