Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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chappychap

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Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

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Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

chappychap

posted on Sep 21, 2022 10:13AM

Yes, no volume indeed. Very disappointing as a long. Are we such a tightly held secret that only we know about it? Are the staff testing these revolutionary products out not interested in a 3x-10x+?

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