Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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oldgreg

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Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

in response to

24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

foxy74

posted on Sep 20, 2022 07:34AM

I agree, very good article. Thanks for sharing Foxy. Got to love the opening paragraph. When will the market wake up to this??

When industry leaders gathered in San Diego for the 2022 Optical Fiber Communication Conference, several of them reacted with amazement and even disbelief when they witnessed demonstrations of the POET Optical Interposer. What impressed the industry in March, and in the months since, is the elegance of the engineering that has led to the development of the innovation’s differentiating features.

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