Agoracom: Small Cap Investment - POET Technologies Inc. - Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

foxy74

Sep 20, 2022 07:14AM

Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

oldgreg

Sep 20, 2022 07:34AM

Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

ahasja

Sep 20, 2022 07:38AM

Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

The Holk

Sep 20, 2022 08:03AM

Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

oldgreg

Sep 20, 2022 08:19AM

Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

foxy74

Sep 20, 2022 08:23AM

Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

fairchijisback

Sep 20, 2022 09:15AM

Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

fairchijisback

Sep 20, 2022 09:19AM

The Holk

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Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

in response to

Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

oldgreg

posted on Sep 20, 2022 10:07AM

Oldgreg: Presume you missed off the link holk?

Same link, page 28.

https://data.angel.digital/pdf/PIC_Magazine_Issue_3_2022.pdf

There must be a very close relationship POET - HGGenuine. Let´s call it orderer or customer.

11 Recommendations

Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

oldgreg

Sep 20, 2022 11:46AM

Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

foxy74

Sep 20, 2022 11:57AM

Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

Gambino

Sep 20, 2022 08:18PM

Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

chappychap

Sep 20, 2022 08:56PM

Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s

Axel

Sep 21, 2022 01:07AM

Re: 24 ISSUE III 2022 I PIC MAGAZINE.NETHYBRID INTEGRATION How a hybrid integration platform for co-packaged photonics solves many of the chip industry’s