ECOC 2022 Basel

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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ECOC 2022 Basel

posted on Sep 13, 2022 07:36PM

Symposium 22.09.2022, 10:45 – 12:30 Suresh to speak at 11:30

Hybrid integration of III-V materials with Silicon Based Waveguides

Organizers

Hélène Debrégeas, Almae Technologies, France
Lucas Soldano, POET Technologies, USA

Program

10:45: Introduction
10:50: Hybrid integration of III-V materials with silicon for high-volume and high-reliability lasers and optical amplifiers, Scott Schube, Intel, USA
11:10: An overview on thick-SOI Silicon Photonic platforms and integration roadmap at VTT, Giovanni Delrosso, VTT, Finland
11:30: Hybrid Integration Platform for Co-Packaged Photonics Using POET’s CMOS Based Optical Interposer, Suresh Venkatesan, POET Technologies, USA
11:50: Hybrid integration of III-V semiconductors on silicon, Dries Van Thourhout, Ghent University - IMEC, Belgium
12:10: Discussion