Some more reality then:

“Further, we believe the Optical Interposer platform is among a few, if not the only, packaging technology that can provide the scale, size, power and cost requirements needed for optoelectronic applications outside of datacom and telecom, including optical computing, AR/VR, wearables, LiDAR and other more consumer-oriented products, that will require vastly larger numbers of devices to be produced annually at lower cost and higher performance.”