This is an interesting recent industry collaboration for the European & global market, and a purely speculative connection to POET. 

https://newsroom.st.com/media-center/press-item.html/c3102.html?icmp=tt27591_gl_bn_jul2022

"In addition to the sizeable, multi-year investment in advanced semiconductor manufacturing in Europe, it will support the leadership and resilience of the European technology ecosystems, from R&D (with the recently announced cooperation on R&D among ST, GF, CEA-Leti and Soitec) to large-volume manufacturing, and support European and global customers with additional capacity in complex, advanced technologies for key end-markets including automotive, industrial, IoT, and communication infrastructure. "

We do know Soitec is a member of the newly formed SHINE centre, and is a leader in wafer bonding by a "Smart Cut" method. 

• The integration platform consists of components using light waveguides made on a silicon substrate. This allows the guided light to undergo the necessary optical treatments such as modulation or filtering. But it is almost impossible to have an optical waveguide with acceptable performance (low propagation loss, etc.) on a silicon substrate without special layers. This is where silicon-on-insulator (SOI) substrates come in.
• The key technology to realize thin-silicon SOI wafers is called Smart Cut, which was invented at CEA-Leti and is manufactured by Soitec. Silicon photonics research and development groups have widely used Smart Cut technology (Figure 6) to industrially manufacture SOI wafer structures. Today, such wafers are widely used in power, radio frequency and CMOS components.https://www.photonics.com/Articles/Silicon-on-Insulator_Substrates_The_Basis_of/a63021

Happy to hear any thoughts on this one.

Hogan Jr.