VLSI Paper - Hybrid Integration 20220207 (poet-technologies.com)

Conclusions: We have demonstrated a unique silicon-based wafer scale hybrid integration photonics packaging platform for applications in current and future datacenter applications. The versatile and low loss platform called the Optical Interposer includes all the features necessary for high speed datacenter applications : Excellent RF performance, low loss, athermal and non-birefringent waveguides and low loss chipfiber coupling, high coupling efficiency passive placement of optical devices, excellent thermal properties with low thermal resistance and low cost through wafer scale assembly and test. Products assembled with the Optical Interposer show excellent performance for 100/200/400G applications.